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Water-soluble abrasive machining soln. compsn. saw 发明授权

2023-04-11 1770 133K 0

专利信息

申请日期 2026-04-24 申请号 JP2001270656
公开(公告)号 JP4497767B2 公开(公告)日 2010-07-07
公开国别 JP 申请人省市代码 全国
申请人 Yushiro Ltd115083; Allied Materials Co Ltd220103
简介 PROBLEM TO BE SOLVED : To provide a water-soluble work liquid composition for abrasive grain fixed wire saws excellent in cutting materials other than rare earth magnets. SOLUTION : The composition contains (A) glycols (such as propylene glycol and polyethylene glycol), and may further contain salts composed of (B) carboxylic acids (such as oleic acid and dodecanoic acid) and (C) compounds soluble in water to show a basic property. The molecular weight of (A) the glycols should preferably be 70-100, 000. The carbon number of (B) the carboxylic acids should preferably be 8-22. The basic compounds (C) should preferably be an alkanolamine, sodium hydroxide, potassium hydroxide, or the like. For cutting silicon, it is preferred that pH be 5.5-9.5 when the composition is diluted ten times in water.


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