| 申请日期 | 2025-06-28 | 申请号 | US11360812 |
| 公开（公告）号 | US7749336B2 | 公开（公告）日 | 2010-07-06 |
| 公开国别 | US | 申请人省市代码 | 全国 |
| 申请人 | Benlih Huang; Hong Sik Hwang; Ning Cheng Lee | ||
| 简介 | A technique for increasing the compliance of tin-indium solders is disclosed. In one particular exemplary embodiment, the technique may be realized as a lead free solder alloy comprising from about 58.0% to about 99.998% by weight tin, from about 0.001% to about 40.0% by weight indium, and from about 0.001% to about 2.0% by weight at least one rare earth element. | ||
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