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COMPOSITION FOR BONDED MAGNET 发明申请

2023-04-27 4370 106K 0

专利信息

申请日期 2025-06-26 申请号 JP2008323236
公开(公告)号 JP2010144227A 公开(公告)日 2010-07-01
公开国别 JP 申请人省市代码 全国
申请人 SUMITOMO METAL MINING CO
简介 PROBLEM TO BE SOLVED : To provide a composition for a bonded magnet, which keeps excellent magnetic properties and is superior in injection molding properties. SOLUTION : The composition for the bonded magnet includes at least a magnet powder and a polyamide resin. The magnet powder contains a rare-earth element, and the polyamide resin has a number average molecular weight in a range of 1, 000-10, 000, which has been determined from the distribution of the molecular weight in terms of polymethyl methacrylate. The composition for the bonded magnet has a 2, 6-di-t-butylphenol structure and further contains 0.04-0.60 mass% of a butylphenol compound having the molecular weight of 200-300. COPYRIGHT : (C)2010, JPO&INPIT


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