申请日期 | 2025-06-25 | 申请号 | WOUS09067218 |
公开(公告)号 | WO2010068635A2 | 公开(公告)日 | 2010-06-17 |
公开国别 | WO | 申请人省市代码 | 全国 |
申请人 | APPLIED MATERIALS INC; SUN Jennifer Y; DUAN Ren guan; THACH Senh; XU Li | ||
简介 | A filled polymer composition having improved plasma resistance is disclosed. The composition includes a particle filler dispersed in a polymer matrix. The particle filler can be Nb2O5, YF3, AlN, SiC or Si3N4 and rare earth oxides. In an embodiment, the composition is utilized as a bonding adhesive for electrostatic chuck, bonding adhesive for shower head, bonding adhesive for liner, sealing material, O-ring, or plastic component. |
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