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METHOD FOR MANUFACTURING BOND MAGNET 发明申请

2023-02-25 4510 108K 0

专利信息

申请日期 2025-06-26 申请号 JP2008287242
公开(公告)号 JP2010114333A 公开(公告)日 2010-05-20
公开国别 JP 申请人省市代码 全国
申请人 DAIDO ELECTRONICS CO LTD
简介 PROBLEM TO BE SOLVED : To provide a method for manufacturing a bond magnet, suppressing deterioration of a magnetic force of a magnetic mold and an expansion variation of an external form, under a high temperature environment. SOLUTION : In the method for manufacturing the bond magnet in which the bond magnet is formed by mixing rare earth magnetic powders ground into a predetermined particle size and a binder, and molding by pressing, a mixture of a thermosetting resin and a thermoplastic resin having a melting temperature higher than a curing temperature of the thermosetting resin is used as the binder. Herein, the melting temperature of the thermoplastic resin is set to a temperature higher 10 to 20°C than the curing temperature of the thermosetting resin, and a mixing ratio of the magnetic powder and the resin is set such that the magnetic powder is 80 to 96 mass%, the thermosetting resin is 2 to 15 mass%, and the thermoplastic resin to 5 mass% or less (however, excepting zero). COPYRIGHT : (C)2010, JPO&INPIT


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