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THERMOSETTING POWDER ADHESIVE COMPOSITION 发明申请

2023-05-05 4520 178K 0

专利信息

申请日期 2025-07-27 申请号 WOUS09063712
公开(公告)号 WO2010054302A1 公开(公告)日 2010-05-14
公开国别 WO 申请人省市代码 全国
申请人 LORD CORPORATION; HALLADAY James R; WEI Kei yi; ABBEY Kirk J
简介 A powder adhesive comprising a primary rubber bonding polymer and a thermosetting component, and a method for bonding elastomers to metals employing the same. By adding a thermosetting component to a powdered adhesive, the adhesive may be applied to a substrate, sintered and thermoset to provide a sweep resistant adhesive film on the substrate, which may subsequently be bonded to an elastomer. Without a thermosetting component, the adhesive is at risk to re-melt or otherwise soften during a heated elastomer molding operation which in turn could cause the adhesive material to sweep off the substrate.


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