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radiation curable pasty composition substantive, method to re-printing a substrate, substrate and 发明申请

2023-09-15 2540 247K 0

专利信息

申请日期 2025-08-18 申请号 BRPI0609853
公开(公告)号 BRPI0609853A2 公开(公告)日 2010-05-04
公开国别 BR 申请人省市代码 全国
申请人 PPG IND OHIO INC
简介 Disclosed are radiation curable putty compositions that include (a) a radiation curable material, (b) a radiation cure initiator, and (c) a filler comprising a polymer, such as a polymer that is transparent to ultraviolet radiation. Also disclosed are methods for refinishing a coated substrate utilizing such putty compositions, and articles coated with such putty compositions.


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