申请日期 | 2025-08-18 | 申请号 | BRPI0609853 |
公开(公告)号 | BRPI0609853A2 | 公开(公告)日 | 2010-05-04 |
公开国别 | BR | 申请人省市代码 | 全国 |
申请人 | PPG IND OHIO INC | ||
简介 | Disclosed are radiation curable putty compositions that include (a) a radiation curable material, (b) a radiation cure initiator, and (c) a filler comprising a polymer, such as a polymer that is transparent to ultraviolet radiation. Also disclosed are methods for refinishing a coated substrate utilizing such putty compositions, and articles coated with such putty compositions. |
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