| 简介 |
The invention concerns sealing compound between magnetic systems and shrouds and a procedure for filling the gaps between the magnetic systems and the shrouds. The sealing compound consists of a mehrkomponentigen solvent-free epoxy resin merging and an epoxy resin hardener on the basis of aliphatic diamines or Polyetherdiamine, whereby the epoxy resin merging with the epoxy resin hardener can harden with Raumtemperturen. The epoxy resin merging exhibits Pumpund pourability and possesses in the polymer chains chemically inserted, the resin matrix making flexible groups of epoxy resins. |
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