| 简介 |
PROBLEM TO BE SOLVED : To provide a re-releasable adhesive, in which the adhesiveness can be sufficiently reduced by curing reaction by radiation irradiation, and the reduction of the adhesiveness or the split of the adhesive, and, further, contamination of a semiconductor wafer and the like with liquid and so on can be inhibited as much as possible, by reducing the liquid immersion properties.
SOLUTION : A re-releasable adhesive includes a radiation reactive polymer and a radiation polymerization initiator, in which the radiation reactive polymer having a side chain originated from one or more monomers represented by CH2=CR1COOR2 (wherein R1 represents a hydrogen atom or a methyl group, R2 represents an alkyl group having 6 or more carbon atoms) and a side chain having one carbon-to-carbon double bond, and the monomers are polymerized in the ratio of 50 mol% of the total monomers constituting the main chain of the radiation reactive polymer.
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