| 简介 |
The adhesive sheet for manufacturing semiconductor device disclosed in the present invention can be detachably adhered onto a lead frame or a wiring broad and has a laminate including a base layer with heat resistance and an adhesive layer containing a thermoplastic resin component (b) and a component (c) for endowing re-detachability. When the adhesive sheet is used to manufacture a semiconductor device such as QFN, the excellent properties of wirebonding and mould flashing may be maintained, the paste leaving and the inferior of semiconductor device can be prevented. |
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