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Slurry composition for a chemical mechanical polishing, method of preparing the slurry composition 发明申请

2023-06-11 4010 523K 0

专利信息

申请日期 2026-04-27 申请号 KR1020080064217
公开(公告)号 KR1020100004181A 公开(公告)日 2010-01-13
公开国别 KR 申请人省市代码 全国
申请人 SAMSUNG ELECTRONICS CO LTD
简介 PURPOSE : A slurry composition is provided to reduce the content of macro particles using abrasive particles in which the shape and size of crystals are controlled and has narrow particle size distribution and to suppress the generation of scratch on an object for polishing.CONSTITUTION : A method for manufacturing a slurry composition for chemical mechanical polishing comprises the steps of : precipitating rare earths metal salts excluding cerium and cerium salts in a water-soluble medium to prepare the precipitate containing rare earths metal and cerium; heat-treating the precipitate to prepare pre-ceria abrasive particles doped with rare earth materials; pulverizing the pre-ceria abrasive particles to prepare ceria abrasive particle; and dispersing the ceria abrasive particle in a water-soluble dispersive medium.COPYRIGHT KIPO 2010


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