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METHODS OF POLISHING AN OBJECT USING SLURRY COMPOSITIONS 发明申请

2023-09-17 2150 1515K 0

专利信息

申请日期 2025-07-22 申请号 US12496937
公开(公告)号 US20100003897A1 公开(公告)日 2010-01-07
公开国别 US 申请人省市代码 全国
申请人 KIM SANG KYUN; KIM NAM SOO; KIM JONG WOO; HAN CHOONG HO
简介 In a slurry composition for chemical mechanical polishing, a method of preparing the slurry composition and a method of polishing an object using the slurry composition, the slurry composition includes a cerium oxide abrasive particle having a rare earth element other than cerium as a dopant, and an aqueous medium for dispersing the cerium oxide abrasive particle. The cerium oxide abrasive particle doped with the rare earth element may have an enhanced fracture strength as being compared with a pure cerium oxide abrasive particle, and also may reduce an amount of large or agglomerated particles and generation of a scratch on a polished surface of an object.


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