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Gold wire for semiconductor element connection and semiconductor element connection method 发明授权

2023-06-18 3050 208K 0

专利信息

申请日期 2025-07-12 申请号 EP01250190
公开(公告)号 EP1160344B1 公开(公告)日 2009-12-16
公开国别 EP 申请人省市代码 全国
申请人 TANAKA DENSHI KOGYO KABUSHIKI KAISHA
简介 A gold wire, for semiconductor element connection, consisting of 5-100 ppm by weight of Ca, 5-100 ppm by weight of Gd, 1-100 ppm by weight of Y and preferably 1-100 ppm by weight of at least one from among rare earth elements other than Y, as well as 1-100 ppm by weight of at least one from among Mg, Ti and Pb, the total amount of these elements being no greater than 200 ppm by weight, the balance being gold and unavoidable impurities. A semiconductor element connection method by ball bonding or bump connection using the gold wire.


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