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SEMICONDUCTOR DEVICES HAVING RARE EARTH METAL SILICIDE CONTACT LAYERS AND METHODS FOR FABRICATING TH 发明申请

2023-11-22 3590 481K 0

专利信息

申请日期 2026-04-18 申请号 US12130263
公开(公告)号 US20090294871A1 公开(公告)日 2009-12-03
公开国别 US 申请人省市代码 全国
申请人 Paul R BESSER
简介 MOS transistors and methods for fabricating MOS transistors are provided. One exemplary method comprises providing a substrate having a silicon-comprising surface region. A first metal silicide layer is formed overlying the silicon-comprising surface region. Ion implantation is used to implant rare earth metal ions at an interface between the first metal silicide layer and the silicon-comprising surface region. The substrate is heated to form a second rare earth metal silicide layer disposed below the first metal silicide layer.


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