客服热线:18202992950

PRESSURE-SENSITIVE ADHESIVE COMPOSITION, PRESSURE-SENSITIVE ADHESIVE SHEET AND SEMICONDUCTOR WAFER 发明申请

2023-07-27 3890 333K 0

专利信息

申请日期 2025-06-27 申请号 KR1020090042231
公开(公告)号 KR1020090118881A 公开(公告)日 2009-11-18
公开国别 KR 申请人省市代码 全国
申请人 LG CHEMICAL LTD
简介 PURPOSE : An adhesive composition is provided to ensure a low hydrophilicity, excellent water resistance, peeling properties, re-peelability and wettability to a wafer by employing an isobornyl (meta)acrylate which is a hard-type monomer. CONSTITUTION : An adhesive composition comprises a (meth) acrylic ester monomer comprising an isobornyl (meth)acrylate; and a polymer of a monomer mixture comprising a crosslinkable monomer containing at least one functional group selected from the group consisting of -OH, carboxylic group and nitrogen-containing functional group.


您还没有登录,请登录后查看下载地址


反对 0举报 0 收藏 0 打赏 0评论 0
下载排行
网站首页  |  关于我们  |  联系方式  |  使用协议  |  版权隐私  |  网站地图  |  排名推广  |  广告服务  |  积分换礼  |  网站留言  |  RSS订阅  |  违规举报  |  京ICP备2021025988号-4