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ALLOY THIN FILM FORMED FROM ALLOY OF METAL RHODIUM AND METAL RHENIUM BY ELECTROLYTIC TECHNOLOGY 发明申请

2023-12-02 2980 56K 0

专利信息

申请日期 2025-07-17 申请号 JP2008133629
公开(公告)号 JP2009263759A 公开(公告)日 2009-11-12
公开国别 JP 申请人省市代码 全国
申请人 KYOEI METAL KK; HENMI HIDEKAZU
简介 PROBLEM TO BE SOLVED : To provide an improved Rh-Re alloy plating bath in an electrolytic rhodium plating applied on a contact part to aim the improvement of durability to prevent the damage and the deterioration of the contact surface due to the oxidation caused by the spark on a contact point which necessitates high sensitive electroconductivity and suffers radical spark due to the repeated on-off and an alloy plating film. SOLUTION : The Rh-Re alloy plating thin film having the alloy ratio Rh : Re of 1.0 : (0.1-1.0) and 0.1-10.0 μ film thickness using a plating bath having a Rh-Re alloy composition prepared by adding Re to a Rh plating bath, is formed. COPYRIGHT : (C)2010, JPO&INPIT


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