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Non-volatile semiconductor memory device manufacturing method 发明授权

2023-07-16 5090 91K 0

专利信息

申请日期 2025-08-13 申请号 JP2002360881
公开(公告)号 JP4358504B2 公开(公告)日 2009-11-04
公开国别 JP 申请人省市代码 全国
申请人 OMI TADAHIRO; SHARP KK
简介 A non-volatile semiconductor memory device comprising : a first insulating film provided on a silicon based substrate; a first electrode provided on the first insulating film as a floating gate; a second insulating film provided on the first electrode; and a second electrode formed as a control gate on the first electrode through the second insulating film, wherein the first insulating film is formed of at least two layers of : a lower silicon nitride film obtained by nitriding the silicon based substrate; and an upper silicon nitride film or upper silicon oxide film formed on the lower silicon nitride film according to a chemical vapor deposition method, and the lower silicon nitride film contains rare gas elements at an area density of 1010 cm-2 or more in at least a part of the lower silicon nitride film.


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