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Method for manufacturing semiconductor device 发明授权

2023-07-09 2930 477K 0

专利信息

申请日期 2026-04-23 申请号 JP2002019634
公开(公告)号 JP4346852B2 公开(公告)日 2009-10-21
公开国别 JP 申请人省市代码 全国
申请人 SEMICONDUCTOR ENERGY LAB
简介 PROBLEM TO BE SOLVED : To lessen the frequency of heat processing a high temperatures (over 600 deg.C) and realize lower temperature processing (600 deg.C or less), process simplification and throughput improvement. SOLUTION : The method comprises forming impurity regions 108 containing a rare gas element (called rare gas) and one or a plurality of kinds of additives selected from H, H2 , O, O2 , P in a semiconductor film having a crystal structure, using a mask 106b, heat treating to getter a metal element contained in the semiconductor film to segregate it in the impurity regions 108 and patterning with use of the mask to form a semiconductor layer 109 of the semiconductor film having a crystal structure.


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