| 简介 |
A lead-free high-temperature electronic solder comprises, by mass, 8 to 22% Sb, 0.5 to 8% Cu and the balance Sn; 8 to 22% Sb, 0.5 to 8% Cu, 0.01 to 2% Ni and the balance Sn; or 8 to 22% Sb, 0.5 to 8% Cu, 0.01 to 2% Ni, 0 to 0.01% at least one of Ga, P, or mixed rare earth and the balance Sn. The melting point of the solder is 240 to 320℃ and the tensile strength is 58 to 84Mpa. The preparing method of solder comprises keeping mixed each alloy element at 700 to 750℃ for 1 to 2 hours using vacuum smelting furnace or anti-vacuum smelting furnace, mixing them before being discharged from the furnace, then pouring, and solidifying. The solder is prepared to be at least one of solder mother alloy, solder block, welding stick, welding ball, welding ring, welding foil, welding powder, or welding paste. The solder has high melting temperature, good oxidation resistance and excellent humidification performance characteristics. |
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