| 申请日期 | 2025-06-24 | 申请号 | KR1020097008390 |
| 公开（公告）号 | KR1020090075699A | 公开（公告）日 | 2009-07-08 |
| 公开国别 | KR | 申请人省市代码 | 全国 |
| 申请人 | TOSHIBA HOKUTO ELECTRONICS CORP; TOSHIBA MATERIALS CO LTD | ||
| 简介 | Disclosed is a soldering material mainly composed of Mo, which does not use Ru that is a rare metal. Specifically disclosed is a soldering material (26, 27) which is composed of 1-3.5 wt%% of C, 1-3.5 wt%% of B and the balance of Mo.© KIPO & WIPO 2009 | ||
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