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Slurry Composition for Chemical Mechanical Polishing and polishing method using the same 发明授权

2023-02-18 4560 250K 0

专利信息

申请日期 2025-07-08 申请号 KR1020060138193
公开(公告)号 KR100819769B1 公开(公告)日 2008-03-31
公开国别 KR 申请人省市代码 全国
申请人 CHEIL INDUSTRIES INC
简介 PURPOSE : A chemical mechanical polishing slurry composition is provided to realize a high polishing rate and improved polishing selectivity even at a low concentration, and to reduce erosion and dicing. CONSTITUTION : A chemical mechanical polishing slurry composition comprises a solid solution containing at least one rare earth metal or rare earth metal oxide selected from Y2O3, Y, Gd and Gd2O3 incorporated into the matrix of polishing particles with a uniform distribution. The matrix comprises at least one selected from the group consisting of Si, SiO2, Al, Al2O3, Ce, CeO2, Ti, TiO2, Zr and ZrO2. The solid solution is used in an amount of 0.01-30 wt%% based on the total weight of the slurry composition. © KIPO 2008


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