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BOND MAGNET AND ITS MANUFACTURING METHOD 发明申请

2023-10-12 1100 54K 0

专利信息

申请日期 2026-03-19 申请号 JP2006217559
公开(公告)号 JP2008042098A 公开(公告)日 2008-02-21
公开国别 JP 申请人省市代码 全国
申请人 DAIDO ELECTRONICS CO LTD
简介 PROBLEM TO BE SOLVED : To provide a bond magnet having a high filling factor of magnetic powder and low deterioration of magnetic characteristics resulting from oxidation, etc. and to provide its manufacturing method. SOLUTION : The bond magnet comprises a super-quenching magnet powder comprising a magnetic alloy containing rare earth elements and a thermoplastic resin, wherein an average particle diameter of the super-quenching magnet powder is 20-100 μm and R of an edge portion is ≥1.5 μm. The method for manufacturing the bond magnet comprises the steps of formulating/kneading the super-quenching magnet powder comprising a magnetic alloy containing rare earth elements and having the average particle diameter of 20-100 μm and R of the edge portion of ≥1.5 μm, and a thermoplastic resin, so that an index n is in a range of 0.2-0.8 and a constant B is in a range of 3, 000-20, 000 to obtain an compound, melting the thermoplastic resin in the compound to obtain a melt compound and molding the melt compound into a predetermined shape by injection molding. COPYRIGHT : (C)2008, JPO&INPIT


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