| 申请日期 | 2026-03-03 | 申请号 | JP2007199390 |
| 公开（公告）号 | JP2008042197A | 公开（公告）日 | 2008-02-21 |
| 公开国别 | JP | 申请人省市代码 | 全国 |
| 申请人 | APPLIED MATERIALS INCORPORATED | ||
| 简介 | PROBLEM TO BE SOLVED : To provide a substrate support assembly having a protection layer for increasing plasma resistant property. SOLUTION : The substrate support assembly includes an electrostatic chuck having an upper substrate support face, and a protection layer disposed on the electrostatic chuck. The protection layer is formed of a ceramic material containing a rare earth metal. COPYRIGHT : (C)2008, JPO&INPIT | ||
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