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RARE EARTH BASE-METAL RESISTANCE SLURRY FOR RARE EARTH THICK-FILM CIRCUIT BASED ON METAL SUBSTRATE A 发明申请

2023-01-04 3100 740K 0

专利信息

申请日期 2025-07-09 申请号 WOCN07002224
公开(公告)号 WO2008014678A1 公开(公告)日 2008-02-07
公开国别 WO 申请人省市代码 全国
申请人 WANG Kezheng
简介 A rare earth base-metal resistance slurry for a rare earth thick-film circuit based on a metal substrate and producing process thereof, the slurry is composed of a function phase and an organic carrier in wt ratio of (65-85) : (35-15). The function phase consists of a Cu-Zn-Y compound powder and a microcrystal glass powder in wt ratio of (75-55) : (25-45). The weight ratio of Cu, Zn and Y in the Cu-Zn-Y compound powder is (62-40) : (35-45) : (3-15). Its producing process includes following steps : (1) preparing the microcrystal glass powder; (2) preparing the Cu-Zn-Y compound powder; (3) preparing the organic solvent carrier; (4) preparing the rare earth slurry. The slurry is in use of ferrite-based stainless steel substrate.


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