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Ceramic bonding material, substrate holding structure and substrate processing device 发明授权

2023-04-16 2180 167K 0

专利信息

申请日期 2025-09-16 申请号 JP2002581355
公开(公告)号 JP4032971B2 公开(公告)日 2008-01-16
公开国别 JP 申请人省市代码 全国
申请人 ASAHI OPTICAL CO LTD
简介 A substrate holding structure having excellent corrosion resistance and airtightness, having excellent dimensional accuracy and having sufficient durability when mechanical or thermal stress is applied thereto is obtained. A holder (1) serving as the substrate holding structure according to the present invention comprises a ceramic base (2) for holding a substrate, a protective cylinder (7) joined to the ceramic base (2) and a joining layer (8) positioned between the ceramic base (2) and the protective cylinder (7) for joining the ceramic base (2) and the protective cylinder (7) to each other. The joining layer (8) contains at least 2 mass % and not more than 70 mass % of a rare earth oxide, at least 10 mass % and not more than 78 mass % of aluminum oxide, and at least 2 mass % and not more than 50 mass % of aluminum nitride. The rare earth oxide or the aluminum oxide has the largest ratio among the aforementioned three types of components in the joining layer (8).


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