| 简介 |
PROBLEM TO BE SOLVED : To provide an SnCu based lead-free solder alloy for manual soldering that enables production of a solder of stable composition with resistance to soldering iron tip thinning nearly equivalent to that of Sn37Pb (eutectic alloy).
SOLUTION : The SnCu based lead-free solder alloy is one comprising 0.1 to 1.5 wt.% Cu and 0.05 to 0.5 wt.% Ag, and further comprising 0.1 to 1.5 wt.% Cu and 0.01 to 0.05 wt.% Fe, with the balance consisting of Sn. Accordingly, there is obtained a solder simultaneously having excellent iron thinning resistance and composition stability. Not only enhancement of iron thinning inhibition but also copper thinning inhibition can be attained by still further comprising 0.001 to 0.05 wt.% transition metal or misch metal being a mixture thereof.
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