客服热线:18202992950

LAMINATED CHIP VARISTOR 发明申请

2023-11-09 3470 88K 0

专利信息

申请日期 2026-04-26 申请号 JP2008110349
公开(公告)号 JP2008182280A 公开(公告)日 2008-08-07
公开国别 JP 申请人省市代码 全国
申请人 TDK CORP
简介 PROBLEM TO BE SOLVED : To provide a laminated chip varistor that appropriately maintains ESD withstand, while reducing the capacitance. SOLUTION : A laminate 3 of the laminated chip varistor 1 has a varistor 7, and a pair of external layers 9 arranged so that the varistor 7 is sandwiched. The varistor 7 includes a varistor layer 11 manifesting the varistor characteristics itself, and a pair of internal electrodes 13 arranged so that the varistor layer 11 is sandwiched. The pair of internal electrodes 13 is electrically connected to the external electrodes 5. A region overlapping with the pair of internal electrodes 13 in the varistor layer 11 has a region, made of a first element body that has rare earth metal for manifesting the varistor characteristics itself, and a plurality of additives containing Co, as the auxiliary elements. The outer layer 9 has a region, made of a second element body that has ZnO as a main constituent, without containing Co, and containing only all additives except Co in the plurality of additives, as the auxiliary elements. COPYRIGHT : (C)2008, JPO&INPIT


您还没有登录,请登录后查看下载地址


反对 0举报 0 收藏 0 打赏 0评论 0
下载排行
网站首页  |  关于我们  |  联系方式  |  使用协议  |  版权隐私  |  网站地图  |  排名推广  |  广告服务  |  积分换礼  |  网站留言  |  RSS订阅  |  违规举报  |  京ICP备2021025988号-4