| 简介 |
PROBLEM TO BE SOLVED : To obtain a peroxide-curing type silicone-based pressure-sensitive adhesive composition for forming a pressure-sensitive adhesive layer having an extremely low migration in which a silicone component is not visually observed on an adherend during a re-release even in the case of a high-temperature treatment of ≥250°C and a pressure-sensitive adhesive tape using the same.
SOLUTION : The peroxide-curing type silicone-based pressure-sensitive adhesive comprises (A) 100 pts.wt. of a diorganopolysiloxane containing alkenyl groups bonded to silicon atoms at both molecular chain terminals represented by the general formula (1) (wherein R1 is a nonsubstituted or substituted monofunctional saturated hydrocarbon group; R2 is a 2-10C alkenyl group; k is an integer of ≥2, 000; and s is 0 or a positive integer satisfying the relation of 0≤s/(k+s)≤0.02), (B) 10-200 pts.wt. of an organopolysiloxane resin containing one or more silanol groups (=OH group) in one molecule and (C) a catalytic amount of at least one kind of an organic peroxide.
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