| 申请日期 | 2025-06-25 | 申请号 | JP2007543916 |
| 公开（公告）号 | JP2008521619A | 公开（公告）日 | 2008-06-26 |
| 公开国别 | JP | 申请人省市代码 | 全国 |
| 申请人 | Alpha Fry Limited503450782 | ||
| 简介 | An alloy suitable for use in a wave solder process, hot air levelling process, a ball grid array or chip scale package comprising no more than 3 wt.% bismuth, from 0.15-1.5 wt.% copper, from 0.1-1.5 wt.% silver, and the balance tin, with optionally other alloying elements in certain embodiments, together with unavoidable impurities. | ||
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