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METHOD FOR FORMING A PATTERN OF METAL FILM AND METHOD FOR FORMING A GATE ELECTRODE IN SEMICONDUCTOR 发明授权

2023-10-06 4790 516K 0

专利信息

申请日期 2025-07-22 申请号 KR1020070045288
公开(公告)号 KR100842764B1 公开(公告)日 2008-06-25
公开国别 KR 申请人省市代码 全国
申请人 HYNIX SEMICONDUCTOR INC
简介 PURPOSE : A method for forming a metal layer pattern and a method for forming a gate electrode of a semiconductor device by using the same are provided to prevent loss of a metal layer by forming an etch-stop layer having high etch selectivity between the metal layer and a hard mask. CONSTITUTION : A metal layer is formed on a semiconductor substrate(10). An etch-stop layer(14) is formed on the semiconductor substrate including the metal layer. A hard mask is formed on the etch-stop layer. A hard mask pattern(15A) is formed by etching selectively the hard mask, in order to expose the etch-stop layer. The etch-stop layer and the metal layer are etched by using the hard mask pattern as an etch mask. The metal layer is composed of a transition metal or a rare-earth metal. The etch-stop layer has etch selectivity higher than the etch selectivity of the hard mask in order to prevent an etching effect thereof in a mask pattern forming process. © KIPO 2008


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