| 简介 |
PROBLEM TO BE SOLVED : To provide a thermal spray powder suitable for forming a thermal spray coating effective in preventing plasma erosion in a semi-conductor device fabrication apparatus and a liquid crystal device fabrication apparatus or the like, a method for forming the thermal spray coating using the thermal spray powder and a plasma resistant member including the thermal spray coating formed from the thermal spray powder.
SOLUTION : The thermal spray powder contains granulated and sintered particles composed of an oxide of any of the rare earth elements having an atomic number from 60 to 70. The average particle size of the primary particles constituting the granulated and sintered particles is 2-10 μm. The crushing strength of the granulated and sintered particles is 7-50 MPa. The ratio of the bulk specific gravity to the true specific gravity of the thermal spray powder is preferably 0.10-0.30. The frequency distribution on the diameter of pores in granulated and sintered particles preferably has its maximum at ≥1 μm. The thermal spray powder is preferably used for applications of forming a thermal spray coating by the plasma thermal spraying. The plasma resistant member 11 has a thermal spray coating 13 formed by thermal spraying the thermal spray powder.
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