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For semiconductor manufacturing equipment 发明授权

2023-03-31 4710 117K 0

专利信息

申请日期 2025-06-24 申请号 JP2018502269
公开(公告)号 JP6462949B2 公开(公告)日 2019-01-30
公开国别 JP 申请人省市代码 全国
申请人 日本特殊陶業株式会社
简介 A semiconductor production device component includes a first ceramic member including an AlN-based material, a second ceramic member including an AlN-based material, and a joint layer disposed between the first ceramic member and the second ceramic member so as to join the first ceramic member and the second ceramic member to each other, wherein the joint layer includes a perovskite oxide represented by ABO3 (wherein A is a rare earth element, and B is Al) and includes no rare earth single oxide containing exclusively a rare earth element and oxygen.


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