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Light-Absorbent Resin Composition for Laser Welding, Light-Absorbent Resin Molding, and Method for 发明申请

2023-01-17 2830 470K 0

专利信息

申请日期 2025-07-29 申请号 KR1020070118637
公开(公告)号 KR1020080046575A 公开(公告)日 2008-05-27
公开国别 KR 申请人省市代码 全国
申请人 SUMITOMO METAL MINING CO LTD
简介 PURPOSE : A light absorbing resin composition for laser welding, a light absorbing resin molded product prepared by using the composition, and a method for preparing the light absorbing resin molded product are provided to obtain transparency after laser welding and to improve the stability of laser welding. CONSTITUTION : A light absorbing resin composition for laser welding comprises a polymer dispersant having a glass transition temperature of 30 deg.C or more; and a laser light absorbing microparticle which is a tungsten oxide microparticle represented by WyOz or a composite tungsten oxide microparticle represented by MxWzOz, wherein 2.0<=z/y<3.0; 0.001<=x/y<=1; and M is at least one element selected from H, He, an alkali metal, an alkaline earth metal, a rare earth element, Mg, Zr, Cr, Mn, Fe, Ru, Co, Rh, Ir, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Al, Ga, In, Tl, Si, Ge, Sn, Pb, Sb, B, F, P, S, Se, Br, Te, Ti, Nb, V, Mo, Ta, Re, Be, Hf, Os, Bi and I. © KIPO 2008


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