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The copper plating film formed on the surface of the rare-earth permanent magnet 发明申请

2023-03-28 2600 115K 0

专利信息

申请日期 2025-06-26 申请号 JP2006531642
公开(公告)号 JPWO2006016570A1 公开(公告)日 2008-05-01
公开国别 JP 申请人省市代码 全国
申请人 Advanced Energy Industries Inc
简介 [Problems] To provide a method for producing a rare earth metal-based permanent magnet having on the surface thereof a copper plating film by using a novel plating solution for use in a copper electroplating treatment capable of forming a copper plating film having excellent adhesiveness on the surface of a rare earth metal-based permanent magnet. [Means for Resolution] The method for producing a rare earth metal-based permanent magnet having a copper plating film on the surface thereof according to the invention is characterized in that it comprises forming a copper plating film on the surface of a rare earth metal-based permanent magnet by means of a copper electroplating treatment by using a plating solution having its pH adjusted to a range from 9.0 to 11.5 and containing at least the following three components : (1) Cu2+ ions, (2) a chelating agent having a chelate stability constant of 10.0 or higher for Cu2+ ions, and (3) a chelating agent having a chelate stability constant of 16.0 or higher for Fe3+ ions (where, the aforementioned chelate stability constants are confined to conditions of pH 9.0 to 11.5).


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