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FET gate structure and fabrication process 发明授权

2022-12-30 2490 427K 0

专利信息

申请日期 2025-06-25 申请号 US11595242
公开(公告)号 US7476600B1 公开(公告)日 2009-01-13
公开国别 US 申请人省市代码 全国
申请人 Petar B Atanackovic
简介 The invention includes a method of fabricating a gate structure for a field effect transistor and the gate structure. The method includes providing a crystalline silicon substrate and epitaxially growing a gate insulating layer of crystalline rare earth insulating material on the crystalline silicon substrate. A gate stack of crystalline silicon is then epitaxially grown on the layer of crystalline rare earth insulating material and doped to provide a desired type of conductivity. The gate insulating layer and the gate stack are etched and a metal electrical contact is deposited on the epitaxially grown gate stack of crystalline silicon to define a gate structure.


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