| 简介 |
PROBLEM TO BE SOLVED : To provide an electroless plating bath which makes it possible to form a diffusion barrier layer of a Re-based alloy, having a uniform thickness regardless of the shape and size of a workpiece, on the surface of a Ni-based alloy by a relatively simple method. SOLUTION : The electroless plating bath for forming a Ni-Re-B alloy, containing not less than 50 at% of Re, on a substrate by electroless plating, has a pH of 6 to 8 and includes a metal supply source component containing Ni2+and ReO4-at an equal equivalent in the range of 0.01 to 0.5 mol/L, a complexing agent component containing citric acid and at least one other organic acid, the concentration ratio of citric acid to the sum of Ni2+and ReO4-being 1/20 to 1/5 and the molar concentration ratio of the total organic acid of the citric acid and the at least one other organic acid to the sum of Ni2+and ReO4-being 1/2 to 10, and a reducing agent component containing dimethylamine-borane, the molar concentration ratio of dimethylamine-borane to the sum of Ni2+and ReO4-being 1/4 to 2. COPYRIGHT : (C)2009, JPO&INPIT |
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