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Dispay unit 发明申请

2023-09-16 1880 1263K 0

专利信息

申请日期 2025-08-01 申请号 US12081738
公开(公告)号 US20080272685A1 公开(公告)日 2008-11-06
公开国别 US 申请人省市代码 全国
申请人 Mitsuharu Ikeda; Toshiaki Kusunoki; Etsuko Nishimura; Tatsumi Hirano; Masatomo Terakado; Takahiro Ueno; Hiroyasu Yanase; Yukio Takasaki; Takaaki Ogasa; Hideyuki Shintani
简介 Hillock is prevented when aluminum wiring is used in order to reduce line resistance in a display unit. The aluminum wiring is formed into multi-layer structure and each layer contains an element which is not solidly solubilized with aluminum. The element are preferably rare earth metal such as Nd, high-melting point transition metals such as Ta and noble metals such as Pd. Intermetallic compounds of aluminum and the element are educed at an interface of the multi-layer wiring and it is prevented that grains of aluminum are enlarged to form hillock.


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