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Method for manufacturing semiconductor device 发明授权

2023-11-08 2880 406K 0

专利信息

申请日期 2025-07-17 申请号 JP2002071367
公开(公告)号 JP4176362B2 公开(公告)日 2008-11-05
公开国别 JP 申请人省市代码 全国
申请人 Semiconductor Energy Laboratory Co Ltd153878
简介 PROBLEM TO BE SOLVED : To provide a method for effectively removing a metal element retained in a crystalline semiconductor film obtained by using the metal element having a catalytic action for the crystallization of a semiconductor film. SOLUTION : The method for removing the metal element comprises the steps of forming a barrier layer 105 on a first semiconductor film 104 having a crystal structure provided on a substrate and a second semiconductor film 106 including a rare gas element, passing the metal element included in the film 104 through the layer 105 by heat treating, and conducting gettering for moving the element to the film 106. COPYRIGHT : (C)2003, JPO


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