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EPITAXIAL FILM, PIEZOELECTRIC ELEMENT, FERROELECTRIC ELEMENT, MANUFACTURING METHODS OF THE SAME, 发明申请

2023-08-20 2270 1473K 0

专利信息

申请日期 2025-07-14 申请号 WOJP08054425
公开(公告)号 WO2008126575A1 公开(公告)日 2008-10-23
公开国别 WO 申请人省市代码 全国
申请人 CANON KABUSHIKI KAISHA; TOKYO INSTITUTE OF TECHNOLOGY; HAYASHI Jumpei; MATSUDA Takanori; FUKUI Tetsuro; FUNAKUBO Hiroshi
简介 There are disclosed an epitaxial film, comprising : heating an Si substrate provided with an SiO2 layer with a film thickness of 1.0 nm or more to 10 nm or less on a surface of the substrate; and forming on the SiO2 layer by use of a metal target represented by the following composition formula : yA(1 y)B (1), in which A is one or more elements selected from the group consisting of rare earth elements including Y and Sc, B is Zr, and y is a numeric value of 0.03 or more to 0.20 or less, the epitaxial film represented by the following composition formula : xA2O3- (1 x)BO2 (2), in which A and B are respectively same elements as A and B of the composition formula (1), and x is a numeric value of 0.010 or more to 0.035 or less.


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