| 简介 |
PROBLEM TO BE SOLVED : To provide a method for forming a metallic thin film having a relatively high adhesion strength to a polyimide resin by a simple process.
SOLUTION : The method for forming a metallic thin film on the surface of a polyimide resin comprises (1) a step of forming a modified layer by opening the imide ring on the polyimide resin surface with an alkali solution; (2) a step of allowing the modified layer to adsorb a metal ion by using a solution containing the metal ion; (3) a step of reducing the metal ion adsorbed to the modified layer by immersing the layer in a solution containing a boron compound at pH 7.5-8.2 and 40-50°C; and (4) a re-imidization step of closing the imide ring.
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