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Target plate joining method 发明授权

2023-04-22 4140 34K 0

专利信息

申请日期 2025-07-01 申请号 JP10301762
公开(公告)号 JP4151859B2 公开(公告)日 2008-09-17
公开国别 JP 申请人省市代码 全国
申请人 RF Industries Ltd first208695
简介 PROBLEM TO BE SOLVED : To obtain an inexpensive joining method by welding an alloy coating of an element which is selected from In, Sn, Pb and an activated metal on a joining surface of a target plate which is selected from carbon, silicon and ceramic, coating a low melting point brazing filler metal onto the joining surface of a lined metallic plate and superposing the target plate on the coating of the lined metallic plate to thermally fuse them. SOLUTION : In this joining method, a process wherein superposed coating is pressurized and solid-phase welded at a temperature equal to or lower than a melting point of coating is preferably prepared, and also an activated metal is preferably Ti. The activated metal is selected from a Ti group element such as Ti, Zr, Hf, a V group element such as V, Nb, Ta, a rare earth element such as La, Ce or the like. Copper, aluminum, an alloy thereof or the like having excellent heat conductivity are used in a lined metallic plate, and a low melting pint brazing filler metal of In, Sn, Pb, Zn base is preliminarily plated on a joining surface between a target plate and the lined metallic plate. When the target plate is joined to the lined metallic plate, both coatings are fused by heating them at a temperature equal to or more than a melting point of at least one side of coated metals.


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