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WAFER 发明申请

2023-05-24 2510 85K 0

专利信息

申请日期 2025-06-28 申请号 JP2008272592
公开(公告)号 JP2009124129A 公开(公告)日 2009-06-04
公开国别 JP 申请人省市代码 全国
申请人 SHINETSU CHEMICAL CO
简介 PROBLEM TO BE SOLVED : To provide a dummy wafer which has a high corrosion resistance against a cleaning gas and an etching gas which are highly corrosive, and can be used for a long period. SOLUTION : The wafer has a rare-earth oxide-sprayed film on the uppermost layer of a substrate. The wafer can prevent reduction in thickness of a semiconductor wafer in cleaning and stabilizing a plasma etching apparatus and a plasma deposition apparatus, and can improve its service life, if used as a dummy wafer, because it has high film hardness. COPYRIGHT : (C)2009, JPO&INPIT


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