| 申请日期 | 2026-04-27 | 申请号 | WOJP08002467 |
| 公开（公告）号 | WO2009057239A1 | 公开（公告）日 | 2009-05-07 |
| 公开国别 | WO | 申请人省市代码 | 全国 |
| 申请人 | TOSHIBA HOKUTO ELECTRONICS CORPORATION; TOSHIBA MATERIALS CO LTD; UEDA Makoto; MORIOKA Tsutomu | ||
| 简介 | Disclosed is a soldering material mainly composed of Mo, which does not use Ru that is a rare metal. Specifically disclosed is a soldering material (26, 27) which is composed of 1-3.5 wt% of C, 1-3.5 wt% of B and the balance of Mo. | ||
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