| 简介 |
The invention relates to a device for the plasma-enhanced chemical surface modification of substrates in a vacuum. Here, at least one layer to a surface of substrates formed but also a removal of such a surface are carried out. In this regard it is the purpose of the invention, to create a possibility, a more favourable electrical conditions in which modification of substrate surfaces by a improved electrical current flow in the vacuum, to achieve. When according to the invention are a substrate within a vacuum chamber on a device from an electrically conductive material formed substrate support, as well as at least some an electrode unit arranged. The Electrode unit is aligned and parallel to the surface of the substrate to be modified to an RF/VHF voltage source electrically conductively connected. Also a reaction gas for plasma formation and surface modification is to report on the electrode unit arranged in a plasma reaction area be introduced between electrode unit and substrate. The plasma reaction area at its radially outer edge is surrounded by an electrical shield, connected to earth potential and electrically conductively connected via the electrode unit with the HF/VHF voltage source. Also present is a Contact frame, the is electrically connected to the shielding. The Contact frame can here be moved. By movement of the... |
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