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PLATING LIQUID AND METHOD OF MANUFACTURING CONDUCTIVE RAW MATERIAL 发明申请

2022-12-31 3880 166K 0

专利信息

申请日期 2025-06-24 申请号 JP2006096651
公开(公告)号 JP2007270236A 公开(公告)日 2007-10-18
公开国别 JP 申请人省市代码 全国
申请人 TDK CORP
简介 PROBLEM TO BE SOLVED : To provide a plating liquid capable of forming a protective film excellent in adhesiveness, corrosion resistance and heat resistance on the surface of a conductive raw material such as rare earth magnet without corroding the conductive raw material such as rare earth magnet. SOLUTION : The plating liquid comprises a nickel salt compound and an amine compound which forms a complex with a nickel ion, and has pH 8 to 12. Molar ratio of the nickel ion to the amine compound is 1.0 to 3.0 times of coordination number of the amine compound to the nickel ion and stepwise formation constant K1 of a primary step reaction when the amine compound forms the complex with the nickel ion preferably falls into the range of K1= 4.0 to 15.0. COPYRIGHT : (C)2008, JPO&INPIT


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