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PROCESSING LIQUID FOR ABRASIVE GRAIN-FIXED WIRE SAW 发明申请

2023-08-31 3850 101K 0

专利信息

申请日期 2025-06-24 申请号 JP2006090489
公开(公告)号 JP2007262275A 公开(公告)日 2007-10-11
公开国别 JP 申请人省市代码 全国
申请人 HITACHI METALS LTD; YUSHIRO CHEM IND
简介 PROBLEM TO BE SOLVED : To provide an aqueous processing liquid without substantially containing boric acid, and used for an abrasive grain-fixed wire saw for cutting a rare earth-based magnet. SOLUTION : This processing liquid used for the abrasive grain-fixed wire saw for cutting the rare earth-based magnet is provided by containing 30 to 40 mass% water soluble tertiary amine, 5 to 10 mass% water soluble secondary amine, 1 to 5 mass% water insoluble secondary amine, 10 to 25 mass% carboxylic acid and 30 to 40 mass% water, and without substantially containing the boric acid, wherein substituents of the amine, other than hydrogen are each independently one kind selected from a group consisting of a hydroxyalkyl, an alkyl, a cycloalkyl, a cycloalkenyl and an acyl. COPYRIGHT : (C)2008, JPO&INPIT


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