客服热线:18202992950

THERMOELECTRIC SEMICONDUCTOR, THERMOELECTRIC CONVERSION ELEMENT AND THERMOELECTRIC CONVERSION MODUL 发明申请

2023-05-02 3930 969K 0

专利信息

申请日期 2025-07-08 申请号 WOJP06318497
公开(公告)号 WO2007108147A1 公开(公告)日 2007-09-27
公开国别 WO 申请人省市代码 全国
申请人 MURATA MANUFACTURING CO LTD; FUJII Sachiko; NAKAMURA Takanori; ANDO Akira
简介 A thermoelectric semiconductor that realizes not only low thermal conductivity but also enhancement of dimensionless performance index. There is provided thermoelectric semiconductor (1) having a laminate structure consisting of a laminate of multiple combinations each composed of principal layer (6) of a first material and sublayer (7) of a second material whose thermal conductivity is lower than that of the principal layer (6) of a first material. When the thermoelectric semiconductor (1) is of n-type, for example, the first material has a composition of the formula (Zn1-xAlx)O, and the second material has a composition of the formula (Zn1-y-zAlyMz)O (M is a divalent or higher valence element not becoming an acceptor, preferably a transition metal element or rare earth element).


您还没有登录,请登录后查看下载地址


反对 0举报 0 收藏 0 打赏 0评论 0
下载排行
网站首页  |  关于我们  |  联系方式  |  使用协议  |  版权隐私  |  网站地图  |  排名推广  |  广告服务  |  积分换礼  |  网站留言  |  RSS订阅  |  违规举报  |  京ICP备2021025988号-4