| 简介 |
PROBLEM TO BE SOLVED : To provide a ceramic circuit board exhibiting excellent durability and heat radiation performance with improved insulation property, joining strength, reliability and thermal conductivity.
SOLUTION : The ceramic circuit board 1 is provided with an intermediate layer 3 comprising a crystalline phase containing one of an RE-Si-O-based oxide and an Re-Si-O-N-based oxide on one side surface of the board 2 comprising a non-oxide ceramic in the thickness direction and a metallic layer 4 having a prescribed pattern shape to be joined to one side surface of the intermediate layer 3 in the thickness direction. A semiconductor 11 is electrically connected to the metallic layer 4.
COPYRIGHT : (C)2007, JPO&INPIT |
客服热线：
手机版
二维码
