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CERAMIC CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME 发明申请

2023-03-04 3190 134K 0

专利信息

申请日期 2025-07-12 申请号 JP2006051260
公开(公告)号 JP2007230791A 公开(公告)日 2007-09-13
公开国别 JP 申请人省市代码 全国
申请人 KYOCERA CORP
简介 PROBLEM TO BE SOLVED : To provide a ceramic circuit board exhibiting excellent durability and heat radiation performance with improved insulation property, joining strength, reliability and thermal conductivity. SOLUTION : The ceramic circuit board 1 is provided with an intermediate layer 3 comprising a crystalline phase containing one of an RE-Si-O-based oxide and an Re-Si-O-N-based oxide on one side surface of the board 2 comprising a non-oxide ceramic in the thickness direction and a metallic layer 4 having a prescribed pattern shape to be joined to one side surface of the intermediate layer 3 in the thickness direction. A semiconductor 11 is electrically connected to the metallic layer 4. COPYRIGHT : (C)2007, JPO&INPIT


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