| 简介 |
PURPOSE : A nanometal colloidal solution for electroless plating which enables a chelating agent, a dispersant and a surfactant as additives to be simultaneously used in a metal salt and ammonia complex of the metal salt, particularly a silver ammonia complex of the metal salt, and has excellent water dispersibility while exhibiting the reproducibility of particle size distribution in a high concentrated metal salt solution is provided.
CONSTITUTION : A metal or precious metal colloidal solution for electroless plating comprises : a chelate dispersant composed of an acrylic acid derivative and a copolymer of maleic anhydride; and a reductant selected from water-soluble alcohols, thioglycol, thioglycolic acid and thiourea. The precious metal includes gold and silver, and salts of the precious metal are in the form of tetrachloroauric acid, silver nitrate, silver acetate, silver perchlorate, silver sulfate, and silver-ammonia complex. The metal includes copper, nickel and aluminum, and salts of the metal are in the form of copper sulfate, copper chloride, nickel sulfate, nickel chloride, and aluminum sulfate.
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