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MOLDING PROCESS AND MOLDING APPARATUS OF MOLD FOR MOLDING, MANUFACTURING PROCESS AND MANUFACTURING 发明申请

2023-09-30 3270 120K 0

专利信息

申请日期 2025-06-24 申请号 JP2006304323
公开(公告)号 JP2007216665A 公开(公告)日 2007-08-30
公开国别 JP 申请人省市代码 全国
申请人 SEIKO EPSON CORP
简介 PROBLEM TO BE SOLVED : To provide a molding process of a mold for molding which is free from the occurrence of a plastic lens being poor in appearance and which can reduce its manufacturing cost. SOLUTION : An injection inlet 3B for injecting a resin raw material is formed on a tape 3 of the mold 4 for molding in which the tape 3 is twisted to the periphery of a first mold 1 for molding and a second mold 2 for molding, and is assembled to it. In this case, the part of the tapes 3 are cut out in a non-annular state, a tab 3A is formed, and this tab 3A is pushed in. The injection inlet 3B is compared with a conventional example formed annularly, it is rare for foreign substances, such as a working waste of a tape substrate, to go into the interior of the mold 4 for molding. Moreover, since what is necessary is just to prepare an ultraviolet curable resin which closes the injection inlet 3B in the peripheral edge of the tab, the using amount of expensive ultraviolet curable resin can be lessened. COPYRIGHT : (C)2007, JPO&INPIT


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